Alchip Technologies and Astera Labs have announced a strategic partnership aimed at accelerating the development of next-generation AI infrastructure for hyperscalers. The alliance brings together Alchip’s expertise in high-performance ASIC design with Astera Labs’ advanced connectivity portfolio, forming a combined solution for rack-scale deployments of AI systems.
The collaboration targets hyperscale cloud operators that are rapidly evolving their AI platforms to meet growing demands for model complexity and scale. As these AI workloads increasingly require custom silicon and high-throughput interconnects, the joint solution aims to provide validated, interoperable components that reduce integration risk and shorten development timelines.
“Our vision is to be the rack-level connectivity partner for hyperscalers,” said Sanjay Gajendra, president and COO at Astera Labs. “As compute platforms evolve to rack-scale systems with complex connectivity needs, our partnership with Alchip enables hyperscalers to deploy AI infrastructure more efficiently, leveraging a wide range of interconnect technologies.”
Custom Silicon and Advanced Connectivity
The demand for more powerful and efficient infrastructure has intensified with the rise of large-scale AI models, necessitating customized architectures that integrate tightly with high-bandwidth fabrics such as CXL, NVLink Fusion, PCIe, UALink, and Ethernet. The partnership aims to streamline this process by combining Alchip’s ASIC development with Astera Labs’ Intelligent Connectivity Platform, including its COSMOS software suite, to offer comprehensive and production-ready solutions.
“The convergence of custom silicon and advanced connectivity is reshaping how AI infrastructure is architected and deployed,” said Johnny Shen, president and CEO of Alchip Technologies. “This collaboration delivers the capabilities that hyperscalers need to execute AI workloads at scale, while meeting the rigorous performance and scalability demands of emerging applications.”
By addressing both compute and connectivity, the two companies aim to foster a more robust silicon ecosystem, reduce development complexity, and accelerate time-to-market for AI infrastructure at scale.
